{"id":8123,"date":"2025-09-11T02:38:53","date_gmt":"2025-09-11T02:38:53","guid":{"rendered":"https:\/\/global-kigyo.com\/?p=8123"},"modified":"2026-02-06T02:44:21","modified_gmt":"2026-02-06T02:44:21","slug":"via-mechanics-ltd-perfect-pitch-performance","status":"publish","type":"post","link":"https:\/\/global-kigyo.com\/ja\/via-mechanics-ltd-perfect-pitch-performance\/","title":{"rendered":"Via Mechanics, Ltd. – Perfect Pitch Performance"},"content":{"rendered":"

In the semiconductor world, the race to commercialize glass is certainly on. As chips shrink and device performance requirements rise, high-end substrates used in semiconductor packaging now demand much greater accuracy than standard PCBs, integrating CPUs, GPUs, memory and HBM chips into a single package. High-performance AI data centers are increasingly demanding chips that can perform at their best in the smallest package size possible, with densely packed microscopic \u201cvias\u201d allowing current to flow. That is where Japan\u2019s Via Mechanics comes in. A pioneer in the precision drilling field, Via Mechanics is bringing new techniques to circuit processing and design. \u201cAs circuits grow more complex, high-density vias are critical,\u201d said company President Hideaki Shimizu. \u201cMeeting these demands requires both mechanical drilling and laser processing, forming through-holes and microvias, respectively. Our machines handle both processes, allowing high-performance packaging for data centers and other applications.\u201d Recently, delicate glass chip substrates have drawn attention for their faster signal transmission and better thermal stability. However, their fragility makes processing challenging. Many companies rely on chemical treatment to create via holes, raising costs and generating hazardous waste. Working with Nippon Electric Glass, Via Mechanics is developing laser-based drilling methods to avoid cracking and chipping. The implications are substantial. \u201cLaser drilling reduces environmental risks and processing costs,\u201d said Shimizu. \u201cWe expect glass substrates to reach commercial use in certain applications by 2028 or 2029, while advanced organic substrates will continue to evolve. There is an increasing need for next-generation substrate materials that can meet the industry\u2019s major challenges, including miniaturization, power saving and mechanical strength.\u201d From an operations standpoint, in July, Via Mechanics became a wholly owned subsidiary of Amada Co., Ltd., a global leader in metal processing machinery. Amada\u2019s expertise in laser oscillator technology and its worldwide procurement network bring major synergies. \u201cJoining Amada enhances our ability to innovate and to deliver solutions globally,\u201d Shimizu explained. With strong operations in Japan, Taiwan, China and Korea, regions central to semiconductor and memory chip production, Via Mechanics is well-positioned to support the fast-growing demand for high-density PCB manufacturing worldwide. \u201cOur overseas network has ample capacity to serve these regions,\u201d said Shimizu.<\/p>\n

High precision 12-axis drilling machine ND-12MA2126, from Via Mechanics.<\/em><\/span><\/span><\/span><\/p>","protected":false},"excerpt":{"rendered":"

In the semiconductor world, the race to commercialize glass is certainly on. As chips shrink and device performance requirements rise, high-end substrates used in semiconductor packaging now demand much greater accuracy than standard PCBs, integrating CPUs, GPUs, memory and HBM chips into a single package. High-performance AI data centers are increasingly demanding chips that can perform at their best in the smallest package size possible, with densely packed microscopic \u201cvias\u201d allowing current to flow. That is where Japan\u2019s Via Mechanics comes in. A pioneer in the precision drilling field, Via Mechanics is bringing new techniques to circuit processing and design. \u201cAs circuits grow more complex, high-density vias are critical,\u201d said […]<\/p>","protected":false},"author":6,"featured_media":8124,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[82],"tags":[490,163,46,528,48],"class_list":["post-8123","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-manufacturing","tag-equipment","tag-machinery","tag-manufacturing","tag-metalworking","tag-semiconductor"],"acf":[],"_links":{"self":[{"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/posts\/8123","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/comments?post=8123"}],"version-history":[{"count":1,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/posts\/8123\/revisions"}],"predecessor-version":[{"id":8125,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/posts\/8123\/revisions\/8125"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/media\/8124"}],"wp:attachment":[{"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/media?parent=8123"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/categories?post=8123"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/global-kigyo.com\/ja\/wp-json\/wp\/v2\/tags?post=8123"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}