{"version":"1.0","provider_name":"Global Kigyo","provider_url":"https:\/\/global-kigyo.com\/ja","author_name":"Content Creator","author_url":"https:\/\/global-kigyo.com\/ja\/author\/content-creator\/","title":"Via Mechanics, Ltd. - Perfect Pitch Performance - Global Kigyo","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"aRTcq4MMVz\"><a href=\"https:\/\/global-kigyo.com\/ja\/via-mechanics-ltd-perfect-pitch-performance\/\">Via Mechanics, Ltd. &#8211; Perfect Pitch Performance<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/global-kigyo.com\/ja\/via-mechanics-ltd-perfect-pitch-performance\/embed\/#?secret=aRTcq4MMVz\" width=\"600\" height=\"338\" title=\"&#8220;Via Mechanics, Ltd. &#8211; Perfect Pitch Performance&#8221; &#8212; Global Kigyo\" data-secret=\"aRTcq4MMVz\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/global-kigyo.com\/wp-includes\/js\/wp-embed.min.js\n<\/script>","thumbnail_url":"https:\/\/global-kigyo.com\/wp-content\/uploads\/2026\/02\/48500555106A4646B1ED998B3F90FD7B-scaled.jpg","thumbnail_width":2560,"thumbnail_height":1560,"description":"In the semiconductor world, the race to commercialize glass is certainly on. As chips shrink and device performance requirements rise, high-end substrates used in semiconductor packaging now demand much greater accuracy than standard PCBs, integrating CPUs, GPUs, memory and HBM chips into a single package. High-performance AI data centers are increasingly demanding chips that can perform at their best in the smallest package size possible, with densely packed microscopic \u201cvias\u201d allowing current to flow. That is where Japan\u2019s Via Mechanics comes in. A pioneer in the precision drilling field, Via Mechanics is bringing new techniques to circuit processing and design. \u201cAs circuits grow more complex, high-density vias are critical,\u201d said [&hellip;]"}